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CERASET® Polysilazane 20

Heat-Curable Ceramic Precursor

CERASET Polysilazane 20 ceramic precursor resin is a 100% "solids" liquid of low viscosity which rapidly solidifies upon heating to 180-200° C. Thermal solidification can be achieved at lower temperatures with the addition of a free radical initiator such as dicumyl peroxide. CERASET Polysilazane 20 can also be cured at room temperature by exposure to UV radiation in the presence of a UV sensitizer. This resin is used primarily in ceramic-related applications such as ceramic matrix composites (CMCs), metal matrix composites (MMCs), ceramic MEMS, ceramic nanocomposites, and ceramic joining. Once solidified, the polymer can be heated to temperatures in excess of 1,000° C to convert it to silicon nitride and silicon carbide-containing ceramic materials. While the processing characteristics for CERASET Polysilazane 20 are virtually identical to CERASET Polyureasilazane, Polysilazane 20 has higher ceramic yield due to the elimination of lower molecular weight components.

CERASET Polysilazane 20 is specifically designed for use in Ceramic Matrix Composites via Polymer Infiltration Pyrolysis routes (PIP), and other high performance ceramic applications where very high ceramic yield and processibility issues are important.

Suggested Applications: